Redmi 10 prime will come with an octa-middle MediaTek Helio G88 SoC, Xiaomi India coping with Director and worldwide vice president Manu Kumar Jain showed on Friday. The chipset became unveiled in July and primary featured on the Redmi 10 that released earlier this month. The confirmation of the MediaTek Helio G88 in addition suggests that the Redmi 10 high will in all likelihood be a rebadged Redmi 10. The Redmi 10 comes with a hollow-punch show and a quad rear digital camera setup. It's also as much as 6GB of RAM and a maximum of 128GB onboard storage.
Manu Kumar Jain has tweeted an photograph to affirm that MediaTek Helio G88 will power the Redmi 10 top. The government additionally referred to that the new phone might be a “widespread upgrade” over the Redmi nine top and Redmi 9 strength.
The teaser posted by using Jain comes just days ahead of the Redmi 10 high release in India that is scheduled for September three. The smartphone is imagined to come as a rebranded Redmi 10 that become launched globally in advance this month with the identical MediaTek Helio G88 SoC.
In advance this week, Xiaomi teased that the Redmi 10 prime will include a hollow-punch show design, adaptive refresh fee, and twin microphones. The smartphone become additionally reportedly spotted last week on the Bluetooth special hobby organization (Bluetooth SIG) site with the version variety 21061119BI, in which the ‘I' on the quit indicated that the version could in particular be for the Indian marketplace.
Redmi 10 Prime specifications (expected)
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